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China’s Huawei touts chip design breakthrough in bid to defy U.S. sanctions

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Nvidia CEO Jensen Huang at the Great Hall of the People in Beijing on May 14.

SHANGHAI, Chinese tech giant Huawei said Monday that it had achieved a breakthrough that would allow it to make cutting-edge chips within five years, touting the news as a milestone in Beijing’s effort to circumvent U.S. technology restrictions.

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Summary

With the United States and China vying for global dominance in artificial intelligence, U.S. sanctions that began in 2019 have largely cut Huawei off from global makers of semiconductor chips, the tiny brains that power everything from smartphones to computers to cars. Washington has also limited Beijing’s access to chip design software and semiconductor manufacturing equipment such as lithography machines, leading the Chinese government to invest billions into developing its own semiconductor supply chain. Huawei said Monday at a tech conference in Shanghai that by 2031, its high-end chips would have transistor density equivalent to 1.4-nanometer processes, which is considered the industry’s cutting edge.

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