Taiwan · China · TSMC · Huawei · Semiconductor · Samsung · Fortune Technology
Huawei touts chip breakthrough to shorten gap with TSMC
Compiled by KHAO Editorial — aggregated from 1 source. See llms.txt for citation guidance.
◌ Single Source
Huawei Technologies Co. said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co., potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment.
Key facts
- If Huawei can manage to make 1.4nm semiconductors in large quantities, it means it’s defying the industry consensus that ASML’s EUV lithography machines are necessary to mass-produce chips
- ASML’s EUV machines are seen as essential in shrinking transistors, and they are used widely by leading global chipmakers including TSMC, Samsung Electronics Co. and Intel Corp. for mass production
- The Star 50 Index in Shanghai, which includes several major Chinese chip firms, rose to a record after He’s announcement on Monday
- The Shenzhen firm has previously filed for patents that show it is trying so-called self-aligned quadruple patterning, or SAQP, that may allow it to produce advanced chips without ASML’s EUV machines
Summary
The executive said that her team has found a way for “sustainable evolution.” She told reporters after her speech on Monday that Huawei can advance its chipmaking prowess significantly without the use of Dutch supplier ASML Holding NV’s extreme ultraviolet lithography machines, widely considered as essential for production of cutting-edge semiconductors that China doesn’t have access to. He added that the Kirin mobile chips to be launched this fall will be the first to adopt the LogicFolding architecture, which helps boost performance of a chip by increasing the number of transistors it carries and optimizing data transmission speed. The Star 50 Index in Shanghai, which includes several major Chinese chip firms, rose to a record after He’s announcement on Monday.