Business · Datacenter Dynamics
SK Hynix to invest $12.85bn in furthered packaging plant in Cheongju, South Korea
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SK Hynix has announced plans to invest $12.85 billion in an advanced packaging manufacturing plant in South Korea.
Key facts
- According to SK Hynix, it will feature three floors of wafer-level packaging (WLP) process lines across 60,000 sqm (646,000 sq ft) and seven floors of wafer test (WT) process lines across 90,000 sqm
- The WT line is slated for completion by October 2027, with the WLP line expected to follow in February 2028
- SK Hynix has announced plans to invest $12.85 billion in an advanced packaging manufacturing plant in South Korea
- Last month, it was reported that the company would spend $7.97bn to acquire an extreme ultraviolet (EUV) scanner from ASML
Summary
Construction of the fab, dubbed P&T7, will begin later this month. The facility will sit on a 230,000 sqm (2.48 million sq ft) parcel of land within the Cheongju Technopolis Industrial Complex. The WT line is slated for completion by October 2027, with the WLP line expected to follow in February 2028. SK Hynix said during the construction phase, an average of 320 workers will be deployed on site, although that figure could increase to 9,000 at peak times.