Data · Datacenter Dynamics
The rise of direct-to-chip cooling as a top AI cooling system
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When data center operators ask: what are the top AI cooling systems for AI workloads in data centers today?
Key facts
- At the center of the direct-to-chip is a Coolant Distribution Unit (CDU), which circulates the coolant while controlling temperature and pressure to prevent overheating
- When data center operators ask: what are the top AI cooling systems for AI workloads in data centers today
- What they are seeking is an architecture that reliably supports high-density AI at scale
- The two main cooling systems for AI workloads are direct-to-chip cooling and immersion cooling, both of which are available as single-phase or two-phase methods
Summary
The two main cooling systems for AI workloads are direct-to-chip cooling and immersion cooling, both of which are available as single-phase or two-phase methods. The use of two-phase direct liquid cooling is likely to grow gradually, with adoption accelerating as chip-level thermal design power (TDP) and thermal flux exceed the practical limits of single-phase systems. Immersion cooling, by contrast, is finding its place through selective adoption, where its architectural trade-offs are justified by performance or operational requirements. As single-phase direct-to-chip cooling gains momentum, they'll turn their focus to how this technology operates and the role it plays in supporting next-generation cooling technologies.