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Nvidia and Intel tout homegrown American chip supply chain prowess as country bolsters local production, but gaps remain

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Image accompanies the article at Tom's Hardware. No description was extracted from the source.

Nvidia shouted proudly in a recent blog post that its network of American manufacturing partners and suppliers now spans 43 states, that TSMC's Phoenix plant is producing Blackwell wafers at volume, and that it plans to produce up to $500 billion of AI infrastructure in the U.S. over four years with partners including TSMC, Foxconn, Wistron, Corning, Coherent, and Amkor.

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Summary

Both accounts hold up at the wafer stage but omit the same downstream step: every Blackwell die that leaves TSMC's Arizona fab still crosses the Pacific to be packaged, no HBM is manufactured or packaged on U.S. soil, and the facilities intended to close those gaps won’t start production until 2028 at the earliest. Foxconn is building a Houston factory to produce GB300 tray modules for Nvidia, and Wistron will assemble and test Nvidia AI systems at a new facility in Fort Worth, Texas. Corning is adding more than 3,000 jobs across optical manufacturing sites in North Carolina and Texas.

Meanwhile, Intel's post lists R&D and manufacturing across Oregon, Arizona, New Mexico, and California, describes Ohio as “a planned site,” and devotes most of its length to workforce programs, K-12 AI education, and the company’s America250 partnership.

Read full article at Tom's Hardware →

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