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Intel, SK hynix shares surge following posts of chip packaging partnership
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Share prices of both Intel and SK hynix have surged following a ZDNet Korea report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with the intention of integrating high-bandwidth memory (HBM) and logic semiconductors.
Key facts
- SK hynix shares have hit an all-time intraday high of $1,320 (1,946,000 Korean Won) on the Korea Exchange, climbing as much as 14.5% and pushing the company's market cap past $900 billion
- The company recently broke ground on a $3.87 billion advanced packaging plant in West Lafayette, Indiana, which is expected to begin operations in 2028, and approved a ₩19 trillion ($12.9 billion)
- Share prices of both Intel and SK hynix have surged following a ZDNet Korea report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge
- Nvidia alone is expected to account for roughly 60% of global CoWoS demand this year, with Broadcom and AMD absorbing another 26%
Summary
SK hynix shares have hit an all-time intraday high of $1,320 (1,946,000 Korean Won) on the Korea Exchange, climbing as much as 14.5% and pushing the company's market cap past $900 billion. EMIB connects multiple semiconductor dies using small silicon bridges embedded directly in the package substrate, rather than relying on the large silicon interposer that underpins TSMC's Chip-on-Wafer-on-Substrate (CoWoS) platform. Intel Foundry has been actively marketing EMIB and its next-gen variant, EMIB-T, to external customers. TSMC's CoWoS lines, meanwhile, have been massively oversubscribed for more than two years.