Semiconductor · TSMC · Saudi Arabia · Hong Kong · Nvidia · Taiwan · Datacenter Dynamics
TSMC first shipped is set to open a second semiconductor fab in Kumamoto in February 2024 as part of its $20bn
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At the time, TSMC CEO C.C. Wei blamed the delay on excessive car traffic in the region, a claim that was later refuted by the Japanese government, which said TSMC had not directly reported any traffic issues.
Key facts
- TSMC first announced plans to open a second semiconductor fab in Kumamoto in February 2024 as part of its $20bn planned investment in Japan
- TSMC’s first semiconductor fab in Kumamoto, Japan, started volume production in late 2024, manufacturing 12-28nm nodes for the automotive and industrial sectors
- Investment in the fab is expected to total $17 billion, local media reported at the time, although TSMC has yet to confirm this figure
- TSMC is expecting to start production of 3nm wafers at its second Japanese chip fab in 2028
Summary
TSMC is expecting to start production of 3nm wafers at its second Japanese chip fab in 2028. The timeline was confirmed in a Taiwanese government filing this week, a month after the chipmaker’s CEO reversed course on its previous manufacturing plans at the site. The company had originally planned to make 7nm chips at the Kumamoto facility, with production slated for late 2027. Investment in the fab is expected to total $17 billion, local media reported at the time, although TSMC has yet to confirm this figure. TSMC first announced plans to open a second semiconductor fab in Kumamoto in February 2024 as part of its $20bn planned investment in Japan.